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工業技術研究院

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技術名稱: MEMS封測技術

技術簡介

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Abstract

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技術規格

感測晶圓尺寸: f 4”~12” 氣密封條寬度:150um (Min.) 氣密封條厚度:< 10um   氣密洩漏率: < 5x10-8mbar.l/Sec 三軸加速度3D堆疊封裝尺寸:4.0x4.0x0.9mm

Technical Specification

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技術特色

微機電構裝製程技術,利用於微機電感測元件之構裝製程技術開發與設計,主要是使用晶圓級之氣密製程技術,在感測封裝體內形成一可控制條件之微氣密空間,並可結合3D堆疊與薄化製程技術,完成微機電感測元件之微型構裝。

應用範圍

手機、筆記型電腦、個人數位輔助配件、汽車導航、數位娛樂搖桿等相關之消費性產品

接受技術者具備基礎建議(設備)

Mask aligner、Sputter、Wafer bonder

接受技術者具備基礎建議(專業)

半導體、材料、物理及電子等相關背景

技術分類 奈米與微機電

聯絡資訊

聯絡人:陳國彰 微系統中心

電話:+886-6-3847136 或 Email:kerwin_c@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-6-3847294

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