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工業技術研究院

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技術名稱: 先進模組封裝技術

技術簡介

(1)模組光學效率影響因子分析,模組結構界面抗反射減損技術: (2)模組用高導電性焊料研究,電池二極體參數量測與焊接材料選用技術 (3)焊接檢測分析技術,焊接缺陷模式之電流傳導失效與發電功率影響 先進模組封裝技術已建立模組結構界面匹配設計、高導電性材料選用技術、焊接檢測分析技術,根據導電率及光學結構設計最佳化,達成模組效率大於15.4%,模組輸出功率≧150Wp的目標。

Abstract

(1) The optical loss factor analysis and antireflection technology of module stack (2) The conductivity material determination to performance optimization (3) The quality inspection technology related to electrical loss, module defect and connection failure The advanced module package technology develops optical matching method, high conductivity material determination and quality inspection technology. According to the optimization of electrical ohmic conductivity and optical matching materials, the module reaches efficiency and power output more than 15.40% and 150Wp.

技術規格

完成模組用高導電性研究及光學匹配改善技術,模組效率達到15.4%(封裝前電池效率≧18.5%),模組輸出功率≧150Wp。

Technical Specification

According to the optimization of electrical ohmic conductivity and optical matching materials, the module reaches efficiency and output power more than 15.4% and 150Wp

技術特色

1.模組封裝材料規格分析技術。2.協助取得IEC、UL國際認證。3.在一年內,輔導廠商建立成熟生產技術與人員訓練。

應用範圍

應用範圍:1.可發電之太陽電池模組。 2.發電系統。 3.照明、通訊、交通工具等電力供應。 4.消費性電子產品之電源。5. 建材一體型太陽電池模組。 應用市場潛力: 1.太陽光電發電系統之太陽電池模組。2. 太陽光電發電系統之建材一體型太陽電池模組。

接受技術者具備基礎建議(設備)

有興趣投入之廠商。

接受技術者具備基礎建議(專業)

有光電等基礎者為佳;使用此相關產品之上下游廠商。

技術分類 02 R太陽光電技術

聯絡資訊

聯絡人:林福銘 太陽光電技術組

電話:+886-6-3636800 或 Email:fminglin@itri.org.tw

客服專線:+886-800-45-8899

傳真:

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