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工業技術研究院

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技術名稱: 散熱型軟性薄膜/基板材料

技術簡介

結合軟板輕量薄型及可撓曲之應用優勢,將其藉由高導熱材料、無機粉體與軟板基材聚亞醯胺的絕緣樹脂材料進行的混成,製作出具高導熱絕緣薄膜及軟性基板,更能符合高耐熱性、高尺寸安定性及低熱阻抗等特性,提供先進構裝所要求的高功能整合及薄型的需求。

Abstract

With high thermal conductivity inorganic powder material and polymer resin insulating material of the hybrid, producing a flexible thermal conductivity substrates and its film is more consistent with light-weight thinner. Can be applied deflection of the advantages of both high heat-resistance, high dimensional stability and low thermal impedance and other characteristics, can be used as high-power LED Packaging packaging materials required.

技術規格

熱傳導值1.5w/m.k、絕緣電壓性3Kv/mil、耐彎折次數100次(夾角選擇:0.8mm荷重:500g)、吸水率:1.0%、耐燃性(UL-V0):pass

Technical Specification

none

技術特色

結合軟板輕量薄型及可撓曲之應用優勢,藉由高導熱材料填充機制,製作出具高導熱絕緣薄膜及軟性基板,更能符合高耐熱性、高尺寸安定性及低熱阻抗等特性,提供先進構裝所要求的高功能整合及薄型的需求。

應用範圍

LED絕緣構裝基板材料

接受技術者具備基礎建議(設備)

樹脂合成.反應器.塗佈機.壓合機.裁切機

接受技術者具備基礎建議(專業)

化學.化工.材料

技術分類 複合材料

聯絡資訊

聯絡人:楊偉達 電子材料及元件研究組

電話:+886-3-5912979 或 Email:WeitaYang@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5914944

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