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工業技術研究院

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技術名稱: 軟質EMI 防護材料

技術簡介

透過分子接枝結構設計,使得環氧樹脂材料具有高柔軟性,搭配導入高電磁波屏蔽粉體進行研磨與微粒分散化,完成具有高可撓性,厚度~25μm下 電磁波屏蔽效力可達~40 dB (@1GHz)材料開發。

Abstract

none

技術規格

高可撓性電磁波屏蔽貼膠材料: 厚度25μm下電磁波屏蔽效力~40 dB (@1GHz)。

Technical Specification

none

技術特色

開發非貴金屬系高撓性電磁波屏蔽貼膠材料,可大幅降低材料及製造成本,相較於目前軟性電磁波屏蔽商品-導電銀/銅貼膠黏著為主的材料,在價格上具有競爭優勢。

應用範圍

1.印刷電路板與IC載板產業 2.環氧樹脂相關產業

接受技術者具備基礎建議(設備)

樹脂合成設備、塗佈設備、基板壓合設備

接受技術者具備基礎建議(專業)

1. 高分子材料合成、有機無機混成技術 2.連續塗佈技術

技術分類 電子有機材料

聯絡資訊

聯絡人:楊偉達 電子材料及元件研究組

電話:+886-3-5912979 或 Email:WeitaYang@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5914944

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