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工業技術研究院

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技術名稱: 高性能LED熱固型透明封裝材料技術

技術簡介

本研究是以高性能LED封裝用透明材料為開發標的。傳統環氧樹脂透明封裝材料具有低成本、易加工以及封裝保護性佳等優點,但環氧樹脂有熱安定性不足和硬化後材料特性過脆等問題,使其在高性能LED應用上受到了很當大的限制。在本計畫中我們開發了反應型矽氧烷樹脂和硬化劑提昇傳統環氧樹脂的熱安定性。熱老化實驗和無鉛回焊實驗結果顯示,此新型透明封裝材料具有很好的耐熱黃變特性;此矽氧烷改質之透明封裝材料沒有矽氧烷混摻環氧樹脂系統常發生的相分離現象和硬化後Tg大幅降低的問題,此系統硬化後呈現無色透明且Tg為150.7℃。我們相信此材料技術是非常適合高性能LED封裝材料應用要求。

Abstract

The light-emitting diode (LED) has begun to penetrate the traditional lighting applications such as display backlight sources, automotive lightings, larger display panels and general lightings. In most designs, the LED devices are encapsulated to prevent the stress shock and humidity corrosion. To give better visibility, transparent epoxy resins are generally used as encapsulant in LED assembly field. In this LED encapsulant development, we developed two siloxane-modified epoxy compositions to improve the thermal stability of current epoxy base encapsulant. The thermal aging and IR-reflow evaluation results confirm the siloxane-modified epoxy encapsulants present excellent thermal resistant properties for high performance LED applications.

技術規格

Tg=150.7℃,110℃/2000小時 透光度衰減小於10%,260℃ IR-relow 5次 透光度衰減小於10%。

Technical Specification

Tg=150.7℃,110℃/2000hrs Decay Tr%<10%, 260℃ IR-relow 5times Decay Tr%<10%.

技術特色

此材料技術加工性符合現有LED封裝製程需求,具專利保護。

應用範圍

光電半導體構裝

接受技術者具備基礎建議(設備)

材料化工業、半導體封裝廠商

接受技術者具備基礎建議(專業)

高分子材料、電子構裝

技術分類 電子有機材料

聯絡資訊

聯絡人:李巡天 光電有機材料及應用研究組

電話:+886-3-51913168 或 Email:htli@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5827697

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