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工業技術研究院

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技術名稱: UV-White LED用高折射率高耐UV光透明螢光膠材料

技術簡介

本研究是以開發UV-white LED光用耐UV透明封裝材料為目標。傳統環氧樹脂透明封裝材料具有低成本、易加工以及封裝保護性佳等優點,但環氧樹脂有熱安定性不足和硬化後材料特性應力過大等問題,雖然純矽氧烷封裝材料具有極佳光熱安定性,但其存在著機械強度不足、高單價等缺點,因此在本研究中我們以開發新型反應型矽氧烷化合物以提昇材料的耐UV光和熱安定性。本系統反應溫度相對較低,適合LED透明封裝材料之應用。經由研究發現此Siliocne epoxy配方組成可以得到具高度透明性熱固材料,並進而評估其耐熱性及耐UV性。實驗結果證明這樣的配方組合具有優良的耐UV性,在130℃高溫儲放約2000小時實驗評估中,可見光區域(450nm~700nm)的穿透度衰減小於10%,UVA-2000小時實驗評估,可見光區域(450nm~700nm)的穿透度衰減小於10%。

Abstract

In this work, we developed thermal and UV-resistant transparent encapsulant for UV-White LED applications. We developed siloxane-modified reactive compounds to improve thermal and UV stability of current epoxy base encapsulant. It was found that the new encapsulant system exhibits excellent UV resistant properties, and the transmittance (450nm~700nm)decay were less than 10% after 130℃/2000hrs thermal aging.

技術規格

Tg=51℃,130℃/2000小時 透光度衰減小於10%,UVA-2000小時透光度衰減小於10%。

Technical Specification

Tg=51℃, 130℃/2000hrs Decay Tr%<10%, UVA-2000hrs Decay Tr%<10%.

技術特色

此材料技術加工性符合現有LED封裝製程需求,具專利保護。

應用範圍

光電半導體構裝

接受技術者具備基礎建議(設備)

材料化工業、半導體封裝廠商

接受技術者具備基礎建議(專業)

高分子材料、電子構裝

技術分類 電子有機材料

聯絡資訊

聯絡人:李巡天 光電有機材料及應用研究組

電話:+886-3-51913168 或 Email:htli@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5827697

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