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工業技術研究院

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技術名稱: 軟性電子用基板材料與取下技術

技術簡介

本技術提供一套方法可以利用現有玻璃設備以玻璃為載板進行軟性電子的製作

Abstract

none

技術規格

適用溫度:透明基板<250oC、非透明基板>350oC,對位精準度<2um

Technical Specification

none

技術特色

本材料是以塗佈方式於玻璃上塗佈離型層材料與塑膠基板材料,透過此方式可以利用現有玻璃鍍膜設備進行軟性電子元件製作,具有良好的對位準確性,為跨入新世代軟性電子最快的捷徑

應用範圍

軟性光電元件

接受技術者具備基礎建議(設備)

1.塗佈機台與烘箱 2.電子元件鍍膜設備"

接受技術者具備基礎建議(專業)

"顯示器、半導體相關 "

技術分類 電子有機材料

聯絡資訊

聯絡人:呂奇明 光電有機材料及應用研究組

電話:+886-3-5919149 或 Email:Chyimingleu@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820057

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