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工業技術研究院

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技術名稱: 生質軟板接著配方技術開發

技術簡介

典型的單面軟質銅箔電路板結構為三層結構,利用上下層分別為銅箔及聚亞醯胺(PI),中間利用熱固型接著膠將上下層貼合。本技術即著重在於具生質份之接著膠材開發及其應用加工製程建立。

Abstract

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技術規格

生質含量≧20% 每批次反應>1kg 實驗室塗佈製程參數與FCCL製作參數 簡易FPC線路製作與撓曲性評估 與銅箔接著強度≧5 lb/in

Technical Specification

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技術特色

本技術利用具交聯官能基之木質素,部分取代石油基之樹脂,以形成具生質成分之接著膠。可符合目前世界對於綠色材料之發展趨勢,該技術已申請中華民國、大陸、美國專利國內業界尚未建立此技術。

應用範圍

軟質銅箔電路板、接著膠

接受技術者具備基礎建議(設備)

需有樹脂合成反應設備、簡易塗佈設備、壓合機、實驗室

接受技術者具備基礎建議(專業)

具備高分子合成技術與樹脂配方背景

技術分類 材料設計及應用

聯絡資訊

聯絡人:楊偉達/張麗敏 電子材料及元件研究組

電話:+886-3-5912979/03-5915167 或 Email:weitayang@itri.org.tw/LiMinChang@itri.org.tw

客服專線:+886-800-45-8899

傳真:none

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