工業技術研究院

技術簡介

一種金屬貫穿式太陽電池的製造方法，包括先提供矽基板，再表面結構化這個矽基板。然後，進行n型摻質擴散製程，以至少於矽基板的正面與背面形成一n型擴散層。之後，在矽基板的正面形成一抗反射層，再將背面之n型擴散層移除。然後，在矽基板的背面與正面分別形成第一與第二金屬膠層，再進行一共燒結製程，使第一與第二金屬膠層成為第一與第二電極。然後，在第一與第二電極以外的區域形成貫穿矽基板的貫穿孔。最後，在矽基板中的各貫穿孔內形成一通孔電極，其中形成通孔電極的溫度需低於600°C。

Abstract

A method of manufacturing metal wrap through solar cell is provided. In the method, a silicon (Si) substrate is provided, and then the Si substrate is texturized. An n-type dopant diffusion process is performed to at least form an n-type diffusion layer on a front and a rear of the Si substrate. Thereafter, an anti-reflection layer is formed on the front of the Si substrate, and the n-type diffusion layer on the rear of the Si substrate is removed. Afterward, a first and a second metal pastes are respectively formed on the front and the rear of the Si substrate, and then a co-firing is performed to transfer the first and the second metal pastes to a first and a second electrodes. A plurality of through holes through the Si substrate are formed in regions except for the first and the second electrodes. After that, a through hole electrode is formed with each of the through holes, wherein a temperature of forming the through hole electrode is less than 600°C.

技術規格

效率比傳統製程多0.3％以上

Technical Specification

MWT solar cells have larger efficiency 0.3％ than conventional cells

技術特色

僅需多一台雷射鑽孔設備，此技術即可應用在矽晶傳統電池生產線上。

應用範圍

矽晶太陽能電池

接受技術者具備基礎建議（設備）

標準矽晶太陽能電池生產線、對位雷射鑽孔設備

接受技術者具備基礎建議（專業）

太陽能電池製造

聯絡資訊