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工業技術研究院

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技術名稱: 銀銅混合導體油墨應用技術

技術簡介

利用金屬粒子材料表面結構、尺度與油墨配方組成之操控,製備銀銅混合油墨,使銅粒子能取代部分銀粒子,並維持原有之特性,有效降低金屬油墨之材料成本。

Abstract

Combined with the metal particle surface, size and formula, prepared Ag-Cu hybrid paste. The Copper particle additions were reduce the paste cost.

技術規格

銀銅比例60wt%:40wt% 導體電阻率≦ 8μΩ-cm 基板附著力 Adhesion ≧ 4B

Technical Specification

Ag:Cu ratio = 60%:40%, resistivity≦ 8μΩ-cm, Adhesion ≧ 4B

技術特色

因應銀金屬價格飆升,有效降低導體油墨之材料成本

應用範圍

1.印刷電路板與IC載板產業 2.電腦資訊、軍事、航太、通訊、半導體、消費性電子和醫療用品所需之模組或晶片構裝

接受技術者具備基礎建議(設備)

1.高速混合機 2.三軸滾輪

接受技術者具備基礎建議(專業)

化學,化工,材料

技術分類 電子有機材料

聯絡資訊

聯絡人:盧俊安 電子材料及元件研究組

電話:03-5914133 或 Email:luchunan@itri.org.tw

客服專線:+886-800-45-8899

傳真:03-5280206

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