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工業技術研究院

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技術名稱: 多層基板熱變形模擬與應力分析技術

技術簡介

本技術探討平面顯示器製程中所發生的熱翹曲問題,並基於多層梁熱變形理論基礎提供實驗建議以反推彈性模數與熱膨脹係數等材料參數。同時探討多次塗層、塑性變形、預拉伸應變等幾種對於玻璃基板影響熱翹曲的因素,以及調整鍍膜或塗層的厚度匹配,以降低熱翹曲量的可能性

Abstract

The finite element method is employed to study thermal warping and its causes in the flat panel display industry. First of all, an experimental method based on the Stoney equation is proposed to obtain the material constants such as elastic modulus and thermal expansion coefficients. In addition, several factors which affect thermal warping are analyzed. They are multi-layered coating, plastic deformation, pre-tension. Finally, the possibility of zero warping is shown by tuning the combination of thickness of the films on the glass substrate.

技術規格

基板尺寸:620mmX 750mm 以下; 層數< 6層; 溫差 < 450度C

Technical Specification

none

技術特色

模擬評估的實用性與多樣性

應用範圍

面板業

接受技術者具備基礎建議(設備)

有限元分析軟體 (複材結構)

接受技術者具備基礎建議(專業)

土木,機械,力學

技術分類 材料設計及應用

聯絡資訊

聯絡人:邱佑宗 前瞻材料基磐技術組

電話:+886-3-591-8239 或 Email:yutschiu@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-583-0239

[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]