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工業技術研究院

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技術名稱: 節能真空絕熱板

技術簡介

本計畫是開發高性能真空絕熱材,用於冷凍系統、冰箱、建築物之隔熱,達到節能減碳,解決能源短缺地球暖化之問題。在此計畫透過超臨界發泡技術開發低密度開孔式芯材。免除HFC製程。減少global warming。開發高阻氣膜,取代高耗能低絕熱之鋁箔,作封裝材。

Abstract

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技術規格

芯材密度可達0.05 g/cm3,開孔率約94%,芯材耐壓可達1 kg/cm2,WVTR: 0.02 g/m2-day,OTR: 0.02 cc/m2-day-atm,熱傳導<0.01 w/m-k。

Technical Specification

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技術特色

使用超臨界微細發泡,泡材孔洞控制在50um以下,具有較佳結構強度及低熱傳導係數。機能性多層高阻隔膜結構,加上貼合高氣密性熱封層,形成可熱封之高阻氣膜。真空度達0.01 torr ,熱傳導係數<0.01 w/m-k。

應用範圍

電冰箱, 展示櫃, 冷凍庫, 冷凍場及冷藏設備之絕熱。Flexible VIP作冬天衣著保暖。高阻氣膜技術可用於military食品藥物 packaging。

接受技術者具備基礎建議(設備)

押出發泡設備

接受技術者具備基礎建議(專業)

熱塑性押出,發泡概念,及流變

技術分類 高分子材料

聯絡資訊

聯絡人:龔丹誠 高分子研究組

電話:+886-3-5732895 或 Email:dankong@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5732347

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