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工業技術研究院

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技術名稱: Adhesive Bonding微凸塊組裝技術

技術簡介

微凸塊技術為3D IC晶片接合組裝關鍵技術,接合後之微接點將直接成為堆疊晶片間電訊互連之媒介。然而目前採用熱壓合組裝之產率不佳,國內外大廠均在尋找有效的解決方案。本計畫結合熱壓合與預置晶圓級底膠材料強化組裝Throughput,可提昇3DIC製程良率與可靠性

Abstract

Thermocompression bonding with adhesive material has been developed to achieve the interconnections and encapsulation simultaneously between stacked chips. This bonding scheme is an effective method providing fast joining process for the improvement of production efficiency. Film-type and paste-type adhesive materials, wafer-level underfill, anisotropic conductive film, and non-conductive film/paste, can be used as an intermediate layer for joints connection

技術規格

1.4-layer Stack 2. 晶片厚度:<100um 3. 細間隙填膠:間隙<20um 4. TSV直徑:15um 5. Bump pitch:30um

Technical Specification

1. 4-layer Stack 2. Chip thickness:<100um 3. underfill gap:<20um 4. TSV diameter:15um 5. Bump pitch:30um

技術特色

德州儀器在該公司產品中即有使用NCP類型材料完成微凸塊間距 40mm的晶片接合;而WLUF類型材料,目前各大膠材廠商亦正積極開發之中,加速其於3DIC晶片上的組裝應用。膠材接合方式的優點,在於微凸塊接點接合的同時,亦完成了晶片間隙的膠材填充,此相較於傳統晶片接合方式,可省卻填膠製程的使用,而能提升整體製程產率,為一具簡單步驟之組裝製程。

應用範圍

1. Memory stack 2. Multi-chip module 3. 3DIC integration SiP

接受技術者具備基礎建議(設備)

高對位精度接合設備

接受技術者具備基礎建議(專業)

電機、電子、材料

技術分類 製程

聯絡資訊

聯絡人:溫國城(860827) 構裝技術組

電話:+886-3-5915654 或 Email:kcwen@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5917193

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