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工業技術研究院

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技術名稱: 功率模組封裝及可靠度技術

技術簡介

車用高功率IGBT power module設計、製作及驗證技術。包括封裝熱傳,應力及電性設計技術,封裝固晶、打線及封裝製程技術,以及車規可靠度驗證技術等

Abstract

IGBT power module design tegenology

技術規格

600V, 450A IGBT power module

Technical Specification

600V, 450A IGBT power module

技術特色

車用高功率IGBT power module設計、製作及驗證技術。包括封裝熱傳,應力及電性設計技術,封裝固晶、打線及封裝製程技術,以及車規可靠度驗證技術等

應用範圍

電動車, 工具機, 風力發電, 變頻空調等

接受技術者具備基礎建議(設備)

熱傳,應力及電性模擬軟體, 打線機,固晶接合設備,真空迴焊機,高功率電性驗證設備(current source, curve tracer, thermal resistance tester, reliability chamber...)

接受技術者具備基礎建議(專業)

電子, 材料及機械相關領域。

技術分類 通訊與光電

聯絡資訊

聯絡人:陳文峰(680027) 構裝技術組

電話:+886-3-5913314 或 Email:CHENTED@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820412

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