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工業技術研究院

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技術名稱: 高導熱石墨強化鋁基複合材料

技術簡介

本技術係特殊的液相壓力滲透方式來製作石墨強化鋁基複合材料,其中石墨可為粉末狀、短纖維、長纖維或與編織後的纖維氈(mat, prepeg),甚至具有3D等向性的發泡碳。本技術可同時適用在陶瓷強化的金屬基複材, 如SiC/Al, Al2O3/Al…等。 利用本製程技術可作出高導熱、低熱膨脹係數和低密度的複合材料,可運用在3C散熱片、均熱片及封裝用之lid,光電用housing用。

Abstract

Development of the graphite reinforced metal and carbon matrix composite materials (Gr./ Al,Gr./Cu andGr./C composite) with the characteristics of superior thermal conductivity, low density as well as low thermal expansion coefficient.

技術規格

石墨強化鋁基複合材料, 熱傳導率可達550 W/m.K(石墨平面方向)以上高於純銅, 密度在2.3 g/cm3左右,熱膨脹係數則在3~10 ppm/K(石墨平面方向),其中石墨強化的體積分率達80%。

Technical Specification

The thermal conductivity and CTE of graphite series Al-based MMC (200×150×1.6 mm) can be up to KXY = 550~300 W/mK, and CTE = 3~10 ppm/K, respectively.

技術特色

利用液相壓力滲透法來發展一種高導熱的石墨強化鋁基複合材料,所選用的石墨本身即具有良好的熱傳導率。石墨強化鋁基複合材料(Gr./Al composite),其石墨平面方向的熱傳導率可達550 W/m.K, 密度2.3~2.6 g/cc, 熱熱膨脹係數在25~50℃溫度下更在3~10 ppm/K以下;因此可取代純銅用於散熱片及均熱片上。

應用範圍

3C散熱用材料:Heat sink、Heat Spreader、substrate;封裝用housing : 如Laser Diode

接受技術者具備基礎建議(設備)

具有類似擠壓鑄造及熱壓之設備

接受技術者具備基礎建議(專業)

具有材料及機械專長

技術分類 金屬材料

聯絡資訊

聯絡人:張志忠 金屬材料研究組

電話:+886-3-5914171 或 Email:chihjongchang@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820207

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