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工業技術研究院

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技術名稱: 構裝變形及應力模擬評估技術

技術簡介

本技術探討IC或LED於構裝製程中所發生的熱翹曲與應力問題,並可進行材料性質參數優化處理,以降低熱翹曲量的可能性,也可作為基板及模封材料供應商調整材料性質的依據

Abstract

The finite element method is employed to study thermal warping and its causes in the IC or LED packaging industry. Furthermore, optimization in introduced to help the supplier of moding materials and that of substrates to tune their products to minimize the thermal deformation of packaged devices .

技術規格

基板尺寸:40mm 以下; 溫差 < 450度C

Technical Specification

none

技術特色

模擬評估的實用性與多樣性

應用範圍

IC與LED構裝業

接受技術者具備基礎建議(設備)

有限元分析軟體 (複材結構)

接受技術者具備基礎建議(專業)

土木,機械,力學

技術分類 工程與自動化研究

聯絡資訊

聯絡人:邱佑宗 前瞻材料基磐技術組

電話:+886-3-5918239 或 Email:yutschiu@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5830239

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