『您的瀏覽器不支援JavaScript功能,若網頁功能無法正常使用時,請開啟瀏覽器JavaScript狀態』

跳到主要內容區塊

工業技術研究院

:::

技術名稱: 電鏡三維斷層掃瞄顯像技術

技術簡介

包含TEM斷層掃描與SEM/FIB斷層掃描,可應用於產生特徵尺寸約在10奈米 ~ 10微米範圍間之樣品的三維結構影像模型。

Abstract

This technique including TEM Tomography and SEM/FIB Tomography is able to produce the 3D structural visualization models of samples with characteristic size range from around 10 nm to 10 μm.

技術規格

斷層掃描取像特徵尺寸: 10 nm ~ 10 μm

Technical Specification

characteristic size for tomography: 10 nm ~ 10 μm

技術特色

微/奈米尺度之三維分析

應用範圍

材料微結構/微化學分析、半導體元件結構分析

接受技術者具備基礎建議(設備)

TEM、FIB/SEM

接受技術者具備基礎建議(專業)

材料、物理、化學、化工

技術分類 材料分析

聯絡資訊

聯絡人:羅聖全 前瞻材料基磐技術組

電話:+886-3-5915296 或 Email:alexsclo@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5910086

[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]