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工業技術研究院

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技術名稱: 多功能SEM顯微結構與成分分析技術服務

技術簡介

一般金屬、陶瓷、半導體、高分子等材料領域之微觀組織、成份、發光特性研究。奈米材料、奈米元件之形貌、結構分析。IC半導體、封裝、光碟、LED等光電相關產業之破壞、故障分析等

Abstract

none

技術規格

Gun:In-lens Thermal Field Emission Gun(Schottky type)Resolution:1.5nm(at 15kV),5.0nm(at 1.0kV)(SEI Image)Operation Voltage:0.5~30kV;Probe Current:200nA Max. Specimen Stage:Eucentric, X=70mm,Y=50mm,Z=23.5mm(WD=3~41mm), T=-5~65°,R=360°Max.Specimen Size:150mm dia*10mm H

Technical Specification

Gun:In-lens Thermal Field Emission Gun(Schottky type)Resolution:1.5nm(at 15kV),5.0nm(at 1.0kV)(SEI Image)Operation Voltage:0.5~30kV;Probe Current:200nA Max. Specimen Stage:Eucentric, X=70mm,Y=50mm,Z=23.5mm(WD=3~41mm), T=-5~65°,R=360°Max.Specimen Size:150mm dia*10mm H

技術特色

a).EDS用於成份分析,包括定性、半定量、特定區 域化學元素之mapping及line?scan等 ;b).CL用於發光光譜量測、影像分析、微量雜質、缺陷分析;c).EBSD用於多晶材料之晶體結構、取向、微區織構、晶粒、晶界性質分析等;

應用範圍

應用於任何產業

接受技術者具備基礎建議(設備)

應用於任何產業

接受技術者具備基礎建議(專業)

.材料、化工、電化學、機械、電機碩士以上

技術分類 材料分析

聯絡資訊

聯絡人:陳世昌 前瞻材料基磐技術組

電話:+886-3-5916842 或 Email:sc_chen@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5910086

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