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工業技術研究院

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技術名稱: 功率元件模組化封裝技術-

技術簡介

功率模組

Abstract

Power module

技術規格

600v,450A

Technical Specification

600v,450A

技術特色

IGBT因在節能的特性上表現優異,讓電力電子產業邁入另一個階段;在應用中以EV/HEV車用成長趨勢最為顯著;在工業設備、軌道車輛及電源供應器等領域

應用範圍

電動車, 工具機, 風力發電, 變頻空調等

接受技術者具備基礎建議(設備)

構裝廠、IC廠封裝部門

接受技術者具備基礎建議(專業)

1. 電子電路學 2. 電磁學 3. 高頻微波電路

技術分類 系統

聯絡資訊

聯絡人:陳文峰 構裝技術組

電話:+886-3-5913314 或 Email:CHENTED@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5917193

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