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工業技術研究院

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技術名稱: LED高速自動化貼合技術

技術簡介

本技術可輔導廠商開發「低溫固晶製程與設備」,完成後可大幅貼近國內封裝業者現況需求,低溫固晶材料可使熱阻降低至1.5℃/W以下,與金錫合金之熱阻相當,且成本為金錫合金之1/10,設備成本可降低1/3,以達成高散熱低成本之固晶方法與設備之需求。此外,並發展多頭固晶設備,同時進行5顆晶粒固晶,可降低固晶時間至0.6s。

Abstract

The technology can assist industry to develop Filp-Chip boning facility and process. It fulfills the requirements by domestic packaging manufacturers; thermal resistance is comparable to AuSn and is lower than 1.5℃/W, material cost is 1/10 of AuSn. Furthermore, facility cost can be reduced by 1/3, and hence, can achieve good thermal dissipation under low cost. We develop multi-chip bonding equipment to reduce process time.

技術規格

1.固晶精度X軸誤差≦30um、Y軸誤差≦ 30um、旋轉角度誤差≦3.5度 。 2.製程溫度誤差≦10℃。 3.下壓力範圍:100g-2000g。 4.視覺精度± 1 um;視覺對位速度40ms/frame(含影像擷取時間)。

Technical Specification

1 bonding accuracy X-axis ≦30um、Y-axis ≦30um、rotation angles ≦ 3.5. 2 Error in prcocess temperature ≦10℃. 3 loading force:100g-2000g. 4 Vision accuracy± 1 um ;alignment speed:40ms/frame (includes image recoding).

技術特色

開發多頭固晶設備,使固晶製程時間可縮短至0.6s以內,並開發高速視覺定位技術,可使固晶誤差小於30um。

應用範圍

LED封裝、半導體IC封裝、POWER IC封裝、雷射晶片封裝。

接受技術者具備基礎建議(設備)

加熱系統、精密移動平台。

接受技術者具備基礎建議(專業)

專業人才:電控、機構設計、材料開發與光電背景。

技術分類 機械自動化

聯絡資訊

聯絡人:黃萌祺 先進製造核心技術組

電話:+886-3-5915841 或 Email:ach@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5826104

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