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工業技術研究院

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技術名稱: 常壓線型電漿裝置技術

技術簡介

本常壓線型電漿技術可針對大面積的基板做快速的處理 ,也適用於R2R 系統 : 應用範圍包括鍍膜、表面活化、接枝、金屬還原等 。

Abstract

The linear plasma system allow a high throughput processing and applicable for R2R system. The plasma system can be used for thin film deposition, surface activation and grafting, metal reduction, etc.

技術規格

電漿源幅寬可依客戶需求建構,最寬1M,最快處理速度 100mm/ sec

Technical Specification

The treatment width of linear plsama can be constructed based on customer‘s request. Width can achieve maximum 1 meter and the speed can achievc maximum 100mm/ sec currently.

技術特色

高密度線型電漿,可容許快速的電漿反應處理。

應用範圍

可應用於光電產業如: 觸控面板、太陽能與顯示器等產業。

接受技術者具備基礎建議(設備)

大氣電漿設備

接受技術者具備基礎建議(專業)

機電整合技術及電漿製程技術

技術分類 精密機械

聯絡資訊

聯絡人:徐瑞美 先進製造核心技術組

電話:19381 或 Email:juimeihsu@itri.org.tw

客服專線:+886-800-45-8899

傳真:none

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