技術簡介
傳統低色偏聚醯亞胺,在高溫段(>300℃),容易有黃化著色現象,為了達到更高耐熱,並維持高透明、低色偏特性,工研院材化所針對單體結構設計,研發一耐高溫低色偏基板材料,並利用奈米無機粒子,降低色偏,此材料薄膜厚度約20μm經過300℃ thermal cycle 4小時測試後,其色偏仍小於2.5。
Abstract
Traditional colorless polyimide at high temperature segment (> 300 ℃), easily have yellow coloration. In order to achieve higher heat resistance and maintain high transparency, low color characteristics, ITRI designed for the monomer structure, developed a high resistance, low yellow index substrate material. ITRI also used organic/inorganic hybrid to improve b* color. After 300 degree four hours thermal cycle test, the transmission of samples presented no change. The b color can maintain below 2.5.
技術規格
none
Technical Specification
none
技術特色
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應用範圍
塗佈型耐高溫透明混成基板材料,可用於卷軸式或批次式製程、耐高溫軟性基板材料、軟性電子應用…等。
Coating type colorless hybrid material with high heat resistance, it can be used for R2R or S2S process , and high thermal resistance flexible substrate, and other flexible electronics applications.
接受技術者具備基礎建議(設備)
none
接受技術者具備基礎建議(專業)
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聯絡資訊
聯絡人:呂奇明 主任 光電有機材料及應用研究組
電話:+886-3-5919149 或 Email:ChyimingLeu@itri.org.tw
客服專線:+886-800-45-8899
傳真:none