工業技術研究院

技術簡介

傳統低色偏聚醯亞胺，在高溫段(>300℃)，容易有黃化著色現象，為了達到更高耐熱，並維持高透明、低色偏特性，工研院材化所針對單體結構設計，研發一耐高溫低色偏基板材料，並利用奈米無機粒子，降低色偏，此材料薄膜厚度約20μm經過300℃ thermal cycle 4小時測試後，其色偏仍小於2.5。

Abstract

Traditional colorless polyimide at high temperature segment (> 300 ℃), easily have yellow coloration. In order to achieve higher heat resistance and maintain high transparency, low color characteristics, ITRI designed for the monomer structure, developed a high resistance, low yellow index substrate material. ITRI also used organic/inorganic hybrid to improve b* color. After 300 degree four hours thermal cycle test, the transmission of samples presented no change. The b color can maintain below 2.5.

技術規格

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Technical Specification

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技術特色

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應用範圍

塗佈型耐高溫透明混成基板材料，可用於卷軸式或批次式製程、耐高溫軟性基板材料、軟性電子應用…等。 Coating type colorless hybrid material with high heat resistance, it can be used for R2R or S2S process , and high thermal resistance flexible substrate, and other flexible electronics applications.

接受技術者具備基礎建議（設備）

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接受技術者具備基礎建議（專業）

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