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工業技術研究院

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技術名稱: 銅電鍍電極太陽電池技術

技術簡介

本技術開發高效率與低成本之低溫電極技術,為銅電鍍電極技術之解決方案;提供太陽電池產業低成本高效率解決方案;並能與下一世代太陽電池整合。

Abstract

In the copper plating technology, the copper plating layers as front side electrodes to replace expensive silver on silicon solar cells for low-cost and self-aligned metallization are investigated.

技術規格

加入標準太陽能電池製程,提昇效率>0.12%,並降低電極成本。

Technical Specification

The Copper plating technology can be combined to the standard solar cell process and enhance the efficiency more than 0.12% and reduce metalization cost at the same time.

技術特色

加入太陽電池產業的太陽電池標準製程,取代傳統銀膠使成本降低,並能使效率提升0.12%以上

應用範圍

太陽電池

接受技術者具備基礎建議(設備)

355/532nm雷射、電鍍設備、退火設備

接受技術者具備基礎建議(專業)

矽晶太陽能電池原理

技術分類 01 綠能環境

聯絡資訊

聯絡人:陳松裕 太陽光電技術組

電話:+886-6-3636821 或 Email:sungyuchen@itri.org.tw

客服專線:+886-800-45-8899

傳真:

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