工業技術研究院

技術簡介

(1) 半導體晶圓Bump Height/CD/Roughness量測技術、顯示器Photo-Spacer/Color Filter形貌量測技術: 我們發展白光干涉術及3D形貌重現演算軟體，可應用在圖案化樣品高度(< 3 um)及CD量測，及樣品表面粗度量測 (Ra < 3 um)。 (2) 晶圓Warpage/Bow及Total Thickness Variation量測技術、光電半導體厚膜量測技術: 我們發展條紋反射形貌輪廓術及彩色共焦形貌輪廓術，可應用在12吋晶圓翹曲(<=1 mm)及厚度(< 700 um)量測，與樣品厚膜量測(< 700 um)。

Abstract

(1) Semiconductor Wafer Bump Height/CD/Roughness Measurement Technology, Display Photo-Spacer/Color Filter Profile Measurement Technology: We develop White Light Interferometry and related 3D profiles reconstruct software. Patterned sample height (< 3 um), CD, and sample surface roughness (Ra < 3 um) can be measured. (2) Wafer Warpage/Bow and Total Thickness Variation Measurement Technology, Optoelectronic Semiconductor Thickness Film Measurement Technology: We develop Fringe Reflection Profilometry and Chromatic Confocal Profilometry. The bow/ warpage (<= 1mm) and thickness (< 700 um) of 12 inch wafer, and sample thickness film (< 700 um) can be measured.

技術規格

(1)圖案化樣品高度(< 3 um)及CD量測; (2)12吋晶圓翹曲(<=1 mm)及厚度(< 700 um)量測

Technical Specification

(1) Patterned sample height (< 3 um) and CD can be measured; (2)The bow/ warpage (<= 1mm) and thickness (<700 um) of 12 inch wafer can be measured

技術特色

同技術簡介

應用範圍

1.半導體晶圓Bump Height/CD量測設備 2.顯示器Photo-Spacer高度量測設備 3.顯示器Color Filter形貌量測設備 4.晶圓全域Warpage/Bow及TTV量測設備 5.光電半導體厚膜量測設備

接受技術者具備基礎建議（設備）

具半導體及光電產業的光學檢測設備開發基礎

接受技術者具備基礎建議（專業）

光電半導體自動化設備技術; 光學檢測模組整合應用技術

聯絡資訊