工業技術研究院

技術簡介

由於智慧手機的普及，無論從低階功能到高階功能的手機，皆搭載了 Wi-Fi 功能，因此在本模組中，實作具 Wi-Fi 功能之硬體 ，其中硬體電路的核心晶片主要以聯發科技股份有限公司所設計之晶片 MT7681，來開發其周邊電路，支援 USB Type A 隨插即用，且能夠透過手機端的 APP 來控制電路之 LED 燈號，藉此模擬控制家庭電器的開關或是家用照明； MT7681 主要針對如家用燈泡、插座、門鎖等小型設備，且支援 802.11b/g/n，可為嵌入式設備設計家電網路服務，並整合低雜訊放大器、電源管理單元、高頻切換器。

Abstract

Due to the popularity of smart phones, in terms of low-level to high-end functions of mobile phones, all equipped with Wi-Fi functionality, so in this module, the real work with Wi-Fi capabilities of the hardware, including the core chip hardware circuit mainly chip in MT7681 by MediaTek Inc. designed it to develop its peripheral circuits, support USB Type A plug and play, and can transmit end of the phone to the control the LED lights, take the analog control home electrical switches or home lighting; this module focused such as household light bulbs, sockets, door locks and other small devices, and support 802.11b/g/n, appliances designed for embedded devices network services, and the integration of low-noise amplifiers, power management unit high-frequency switch.

技術規格

規格說明 －操作頻率：2412~2483.5MHz (ISM band). －支援 IEEE 802.11b/g/n 標準(1T1R). －工作電壓：3.3 V. －Flash容量：8 Mbits. －耗電流：Rx 151 mA / Tx 242 mA. －睡眠模式：1.1 mA. －工作環境：溫度-10 ~ 70℃. －儲存環境：溫度-20 ~ 80℃. －安全機制：WEP 64/128, WPA, WPA2.

Technical Specification

Specifications - Operating Frequency: 2412 ~ 2483.5MHz (ISM band). - Support IEEE 802.11b / g / n standard (1T1R). - Operating voltage: 3.3 V. - Flash Capacity: 8 Mbits. - Current consumption: Rx 151 mA / Tx 242 mA. - Sleep mode: 1.1 mA. - Working environment: Temperature -10 ~ 70 ℃. - Storage environment: Temperature -20 ~ 80 ℃. - Security: WEP 64/128, WPA, WPA2.

技術特色

晶片體積小，功耗低且價格相較於TI CC3000/CC3200相對便宜，不需外掛MCU。

應用範圍

可掛載至具SAANET protocol之家電中

接受技術者具備基礎建議(設備)

Wi-Fi AP、NB

接受技術者具備基礎建議(專業)

無線通訊、網路通訊架構

聯絡資訊