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工業技術研究院

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技術名稱: 感光重分佈層材料

技術簡介

先進封裝用RDL感光材料,可在低溫(<230C)進行硬化,符合未來低溫、低應力的構裝需求!

Abstract

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技術規格

none

Technical Specification

Resolution ≦5μm /5μm (L/S),CTE ≦80 ppm,Td 5% weigth loss≧ 340 ℃ , Post cure temp ≦230℃,Tg(TMA)≧240 ℃ , Chemical resistance(10%KOH、10%H2SO4、 NMP),Developer :2.38% TMAH,thickness ≦5μm

技術特色

在2.5D/3D構裝中RDL製程中多次多層的製程工序,因此低溫硬化的重分佈層(RDL)材料可以降低高溫熱硬力的殘留,避免結構翹曲,並有效提升2.5D/3D構裝的良率 。

應用範圍

半導體封裝用RDL感光絕緣層

接受技術者具備基礎建議(設備)

樹脂合成設備、塗佈設備、黃光微影設備

接受技術者具備基礎建議(專業)

化學,化工,材料

技術分類 電子有機材料

聯絡資訊

聯絡人:楊偉達 電子材料及元件研究組

電話:+886-3-5912979 或 Email:weitayang@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5914944

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