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工業技術研究院

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技術名稱: 軟性透明可撓式LED照明系統

技術簡介

本技術為一種以CSP技術為元件開發架構提高國內晶片技術之競爭優勢,增加曲面光源的使用與普及性,創造更高的照明生活品質。

Abstract

This technology is a Enhance core competency of Taiwanese LED chip by CSP technology, Improve the pentration rate of curved surface light source, and create high quality lifestyle of lighting

技術規格

none

Technical Specification

none

技術特色

*透明可撓式超薄面光源 (厚度≦7 mm)。 *利用創新超廣角CSP設計,同時具有可撓、薄型化與均勻化特性。 *實現LED薄型化均勻面光源技術,開拓LED穿戴式應用市場之機會。 *Transparent Flexible Ultra-thin lighting source. (thickness≦ 7 mm) *The innovative super wide emitting angle CSP design to achieve flexible, ultra-thin and uniform feature. *Realize the ultra-thin and uniform of planar light source technology, and explore the opportunity in market of wearable devices application.

應用範圍

照明 Lighting Flexible OLED Display

接受技術者具備基礎建議(設備)

none 邱國展 主任 聯絡電話:(03) 5916895 E-mail:JeffreyChiou@itri.org.tw

接受技術者具備基礎建議(專業)

none

技術分類 電子有機材料

聯絡資訊

聯絡人:邱國展 主任 光電有機材料及應用研究組

電話:+886-3-5916895 或 Email:JeffreyChiou@itri.org.tw

客服專線:+886-800-45-8899

傳真:none

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