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工業技術研究院

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技術名稱: MEMS數位麥克風模組技術

技術簡介

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Abstract

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技術規格

封裝尺寸:3.6mm×3.6mm×1.1mm 頻率響應: 100Hz~10KHz 靈 敏 度:-40dB 訊 噪 比:>53dB

Technical Specification

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技術特色

工研院利用CMOS 製程、低雜訊數位感測讀取電路與ITRI專利之超薄封裝開發出CMOS MEMS整合之數位麥克風,具有SOC尺寸小、數位輸出優勢並在結構、封裝等相關專利突破國際大廠封鎖,主要應用於手機及行動裝置上,以及具有指向性或噪音消除等相關功能需求之3C消費性產品應用。

應用範圍

手機、筆記型電腦、免持聽筒、助聽器等相關消費電子與醫療產品

接受技術者具備基礎建議(設備)

力學模擬軟體與電腦硬體、聲學模擬軟體與電腦硬體、電磁模擬軟體頻譜儀與電腦硬體、頻譜儀、訊號產生器、DC電源產生器、探針台、晶粒檢測設備、聲音頻率響應量測設備

接受技術者具備基礎建議(專業)

電子學、電機學、物理學、材料學、力學、封裝與測試技術、聲學、微機電技術

技術分類 微機電元件

聯絡資訊

聯絡人:陳國彰 智慧微系統科技中心

電話:+886-6-3847136 或 Email:kerwin_c@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-6-3847294

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