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工業技術研究院

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技術名稱: MEMS麥克風

技術簡介

本技術著重在電容式麥克風元件結構、製作、讀取電路、封裝與應用技術之開發,利用MEMS製程設計製作出電容式麥克風,較一般傳統 ECM 麥克風具有小型化及易加工的特性,並適用於指向性或噪音消除等相關功能需求之3C消費產品應用。

Abstract

The research is focused on the MEMS capacitive microphone technology development, which including sensor design 、sensor manufacture process 、sensor read out circuit and sensor package. The MEMS microphone can be applied to directional and noise cancellation application for 3C product.

技術規格

尺寸:4.8mm×3.9mm×1.5mm 頻率響應:100Hz~10KHz 靈 敏 度:-40dB 訊 噪 比:53dB

Technical Specification

Dimension: 4.8mm×3.9mm×1.5mm Frequency response: 100Hz~10KHz Sensitivity: -40dB Signal to Noise ratio: 53dB

技術特色

微機電麥克風是利用標準CMOS半導體製程製作出電容式微機電麥克風,並著重於元件設計、製程、讀取電路、封裝與應用等技術,可應用於3C 消費產品上。

應用範圍

行動電話、筆記型電腦、藍牙耳機、遊戲玩具、導航機、助聽器等3C消費電子及相關醫療產品。

接受技術者具備基礎建議(設備)

電腦、音效卡、揚聲器、頻譜儀、訊號產生器與示波器。

接受技術者具備基礎建議(專業)

電子電路與聲學相關背景。

技術分類 微機電元件

聯絡資訊

聯絡人:陳國彰 智慧微系統科技中心

電話:+886-6-3847136 或 Email:kerwin_c@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-6-3847294

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