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工業技術研究院

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技術名稱: 3D MEMS pkg TSV技術

技術簡介

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Abstract

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技術規格

Via drilling : Taper Etch profile (深寬比 > 30 ;選擇比 > 60:1) Seed layer : > 7:1 (Dia. 10mm; Deep 70mm) Wafer bonding : Copper to Copper Temporary wafer bonding

Technical Specification

none

技術特色

提供MEMS 元件、光電元件及電子元件等晶圓級封裝所需之製程封裝技術。

應用範圍

微機電元件,如麥克風 、加速度計 光電元件,如CMOS image sensor等 電子產品堆疊封裝,如DRAM等

接受技術者具備基礎建議(設備)

Mask aligner、 Sputter、 ICP

接受技術者具備基礎建議(專業)

半導體、材料、物理及電子等相關背景

技術分類 微機電元件

聯絡資訊

聯絡人:陳國彰 智慧微系統科技中心

電話:+886-6-3847136 或 Email:kerwin_c@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-6-3847294

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