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工業技術研究院

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技術名稱: 微均熱片技術

技術簡介

本計畫發展微型蒸汽槽式(Vapor Chamber)均熱片之設計、製造、與測試技術,利用毛細結構導流與兩相流沸騰熱傳原理,完成尺寸:31 ×31×2 mm3薄型均熱片與150×30×5 mm3之長板狀均熱片,可搭配各種電子與光電系統設計散熱模組,達到高效率均熱、散熱之效果。

Abstract

The vapor chamber is designed, manufactured and tested during the project developed. The micro capillary structure and two phase flow of working fluid are resulted in high performance vapor chamber. The vapor chamber aspect dimension are 31 ×31×2 mm3 and 150×30×5 mm3. For hot spot of element the vapor chamber can induce more uniform temperature and high performance cooling.

技術規格

Equivalent Thermal Conductivity 1200W/mK Thermal Resistance ≦ 0.2 K/W Power Load 130 W

Technical Specification

Equivalent Thermal Conductivity 1200W/mK Thermal Resistance ≦ 0.2 K/W Power Load 130 W

技術特色

利用工作流體兩相流沸騰,將元件所產生之熱點(Hot Spot)快速且大面積移熱,具有較佳均溫性,提升散熱鰭片之散熱效率,增加電子元件或LED之壽命,也可應用於目前能源產業之聚光型太陽能之均熱與移熱。

應用範圍

High Power LED之均熱與散熱 電腦與伺服器晶片散熱 背光光源、投影光源之均熱與散熱 高階與行動電子產品散熱 光通信元件之均熱與穩定溫控應用

接受技術者具備基礎建議(設備)

散熱模組廠或系統應用廠,具金屬加工與產品組裝相關設備。

接受技術者具備基礎建議(專業)

熱流、機械相關背景。

技術分類 微機電元件

聯絡資訊

聯絡人:陳國彰 智慧微系統科技中心

電話:+886-6-3847136 或 Email:kerwin_c@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-6-3847294

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