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工業技術研究院

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技術名稱: 低毒性高活性無電鍍技術

技術簡介

開發低毒性無電鍍銅藥液,藉由乙醛酸取代傳統高毒性之甲醛還原劑,由於乙醛酸雖然無毒,但會被氧化成草酸,進而影響銅沉積,故藉由微量添加劑,如:一級胺、矽酸鹽、磷酸鹽等抑制草酸根副反應產生,可藉由乙醛酸還原劑提高作業與環境安全

Abstract

none

技術規格

無電鍍金屬沉積速度≧5μm/hr、厚度均勻度≦10%

Technical Specification

none

技術特色

開發低毒性無電鍍銅藥液,藉由乙醛酸取代傳統高毒性之甲醛還原劑,由於乙醛酸雖然無毒,但會被氧化成草酸,進而影響銅沉積,故藉由微量添加劑,如:一級胺、矽酸鹽、磷酸鹽等抑制草酸根副反應產生,可藉由乙醛酸還原劑提高作業與環境安全。

應用範圍

手機天線、LED、半導體、微機電

接受技術者具備基礎建議(設備)

無電鍍設備

接受技術者具備基礎建議(專業)

材料、化學基礎知識

技術分類 光電/電子產業

聯絡資訊

聯絡人:黃萌祺 先進製造核心技術組

電話:+886-3-5915841 或 Email:ach@itri.org.tw

客服專線:+886-800-45-8899

傳真:none

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