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工業技術研究院

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技術名稱: 高產出鈍化層封裝設備技術

技術簡介

自主開發高產出鈍化層封裝技術,包括ICP-CVD電漿設備 & Robot真空傳片設備,以有機矽氧烷單體製備可調控複合鈍化封裝層。

Abstract

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技術規格

1.阻水氣率(WVTR≦5x10-6g/m2day) 2.製程溫度≦80℃ 3.基板大小: 200mm x 200mm

Technical Specification

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技術特色

自主開發高產出鈍化層封裝技術,包括ICP-CVD電漿設備 & Robot真空傳片設備,以有機矽氧烷單體製備可調控複合鈍化封裝層。

應用範圍

OLED照明封裝,高阻水氣軟板

接受技術者具備基礎建議(設備)

PECVD電漿鍍膜設備硬體 & PLC程控軟體

接受技術者具備基礎建議(專業)

具PECVD電漿鍍膜 & 真空設備專長

技術分類 光電與半導體製程設備

聯絡資訊

聯絡人:鄭志宏 雷射中心

電話:+886-6-6939053 或 Email:chengbicha@itri.org.tw

客服專線:+886-800-45-8899

傳真:none

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