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工業技術研究院

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技術名稱: 透明硬脆材料雷射切割模組與技術

技術簡介

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Abstract

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技術規格

可切割材料厚度 ≧ 2 mm 切割速度 ≧ 300 mm/s Chipping ≦ 10 μm Roughness ≦ 2 μm

Technical Specification

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技術特色

透過幾何光學干涉方法產生垂直光型雷射切割技術,在材料內部形成長線型光束,以長線光型雷射切割技術取代現有單點加工技術,並開發可變長度線型光路模組,在材料內部形成最佳垂直線型光束,解決傳統單點加工周圍熱影響造成加工邊緣因熔融產生突緣及毛邊問題。

應用範圍

藍寶石、強化玻璃及素玻璃外型輪廓切割及切孔

接受技術者具備基礎建議(設備)

雷射功率計、beam profiler

接受技術者具備基礎建議(專業)

光學、雷射製程

技術分類 FY105-雷射應用

聯絡資訊

聯絡人:廖金二 L100

電話:+886-6-6939109 或 Email:artliao@itri.org.tw

客服專線:+886-800-45-8899

傳真:none

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