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工業技術研究院

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技術名稱: 無切割損晶片技術

技術簡介

使用非切割方式進行矽晶片的製作

Abstract

A silicon wafer fabricated method without slicing.

技術規格

矽晶片

Technical Specification

silicon wafer

技術特色

太陽能矽晶片在傳統製程上需要經過長晶與切片的製程,而本技術是利用磊晶在基板上生長出矽單晶層再剝離下來得到單晶片,因此不需要經過塊晶生長與切片製程,生產成本較低。

應用範圍

太陽能用矽單晶片製造

接受技術者具備基礎建議(設備)

磊晶設備,酸鹼蝕刻設備

接受技術者具備基礎建議(專業)

磊晶技術,化學蝕刻技術

技術分類 02 R太陽光電技術

聯絡資訊

聯絡人:陳松裕 太陽光電技術組

電話:06-3636821 或 Email:sungyuchen@itri.org.tw

客服專線:+886-800-45-8899

傳真:

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