工業技術研究院

技術簡介

塗佈型耐高溫透明基板材料開發，可用於卷軸式或批次式製程。

Abstract

Solution-casting type colorless material with high heat resistance is developed, which can be used for R2R or S2S process.

技術規格

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Technical Specification

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技術特色

本材料透過單體選擇、單體結構設計及hybrid 粒子自組裝機制，得到耐高溫hybrid PI基板材料。此耐高溫透明hybrid PI基板材料技術，可提高透明基板之穩定性。此技術亦可延伸研發應用於透明顯示模組，以滿足高效能LTPS TFT製程需求。 The high temperature resistant hybrid PI substrate was obtained by monomer selection, monomer structure design and self-assembly sol-gel reaction mechanism. This high temperature and transparent hybrid PI substrate material technology can improve the stability of transparent substrate. This technology can also be applied to the transparent display modules to meet the requirements of high performance LTPS TFT processes.

應用範圍

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接受技術者具備基礎建議（設備）

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接受技術者具備基礎建議（專業）

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聯絡資訊