工業技術研究院

技術簡介

PI基材上有不可視之缺陷與刮傷，會導致阻水阻氣層鍍製不夠平坦或是需要鍍很多層才能達到效果，此高耐熱透明填平層材料具有缺陷修補與填平斷差等功能，材料具高耐熱與低釋氣特性，能穩定後續製程且不黃變。

Abstract

The imperceptible defects and scratches on PI substrate will lead to the pinhole occurs during gas barrier process. We developed highly thermal stable & transparent material

技術規格

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Technical Specification

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技術特色

本材料技術為一種熱感型高耐熱低釋氣填平層材料，主要由高耐熱與高流平特性樹脂所組成，此材料為液態型，使用濕式塗佈製程，具有薄型化、高耐熱與優異的流動特性，能夠於OLED與觸控應用上當作高透明與高耐熱填平層材料。 Our material is mainly based on thermal sensitive and highly thermal stable passivation layer technology. We incorporated thermal stable and leveling resin as mainly components. It is using wet coating process, and the technique have thinning tendency, high thermal stability and good mobility. This material has great potential in both OLED and touch sensor application.

應用範圍

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接受技術者具備基礎建議（設備）

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接受技術者具備基礎建議（專業）

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聯絡資訊