技術簡介
「多用途軟性電子基板技術(Flexible Universal Plane for Display and Electronic Applications) - FlexUPTM」是一應用於軟性電子研發與生產的平台技術,依不同軟性電子元件製作條件的需求,能夠從奈米材料選擇、結構設計與製程匹配等關鍵點進行調整因應,相容於現行片對片傳送(Sheet to sheet, S2S)之設備與製程(例如TFT-LCD),具備耐高溫(~450℃)、高重覆對位精度(≦2μm)等優點。讓國內廠商能運用既有的生產製程優勢,轉進軟性顯示器、軟性觸控薄膜、軟性感測器、軟性醫材與軟性太陽能電池等高附加價值的產品,令其在相同的投資及環境下,利用技術的創新創造出價值的差異化。
此一創新科技具有簡易及低成本特點,已被運用於軟性AMOLED及軟性觸控薄膜開發上,並整合成一軟性觸控AMOLED模組。
Abstract
ITRI developed a Flexible Universal Plane, FlexUPTM, for display and electronic applications. The backplane possesses preferable properties of high temperature resistance, deformation resistance, low surface roughness and easy-to-peel. This technology is a solution-type PI with a compatible de-bonding layer that can be formed at below 220℃ for transparent or 450℃ for brownish substrates with accuracy as high as 2μm. The flexible active matrix display is delivered in the process sequence of TFT array fabricated on the PI layer followed by fabricating flexible OLED and encapsulated with packaging process. The final flexible AMOLED can easily be separated from the glass substrate.
技術規格
none
Technical Specification
none
技術特色
同上
應用範圍
none
接受技術者具備基礎建議(設備)
none
接受技術者具備基礎建議(專業)
none
聯絡資訊
聯絡人:謝旺廷(970199) 面板整合技術一組
電話:13551 或 Email:wthsieh@itri.org.tw
客服專線:+886-800-45-8899
傳真:none