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工業技術研究院

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技術名稱: 可摺疊AMOLED力學模擬技術

技術簡介

透過面板彎曲應力的解析解推導及有限元素軟體,建立面板彎曲應力模擬技術與機械式取下應力模擬技術,以用於評估面板彎曲與取下時之失效風險。另透過薄膜機械特性量測技術之建立,確立薄膜機械特性,以提高模擬準確度,且模擬結果與實測結果趨勢吻合。

Abstract

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技術規格

1. 彎曲應力模擬:產出AMOLED各膜層應力、降服或斷裂風險係數、中性軸位置。 2. 取下應力模擬:產出機械式取下時AMOLED各膜層的應力、不同取下方法(定角度、取下元件、取下載板)之應力分析與比較。 3. 薄膜機械特性量測:奈米壓痕、奈米刮痕、微拉伸技術,可量測AMOLED各膜層的楊氏係數、降服強度、斷裂強度、界面附著力。

Technical Specification

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技術特色

透過面板彎曲應力的解析解推導及有限元素軟體,建立面板彎曲應力模擬技術與機械式取下應力模擬技術,以用於評估面板彎曲與取下時之失效風險。另透過薄膜機械特性量測技術之建立,確立薄膜機械特性,以提高模擬準確度,且模擬結果與實測結果趨勢吻合。

應用範圍

軟性智慧行動裝置、軟性照明

接受技術者具備基礎建議(設備)

ANSYS軟體與電腦

接受技術者具備基礎建議(專業)

具機械或力學相關專長之人員

技術分類 顯示中心

聯絡資訊

聯絡人:郝晉明 企劃與研發策略組

電話:03-5911271 或 Email:erichau@itri.org.tw

客服專線:+886-800-45-8899

傳真:03-58220046

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