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工業技術研究院

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技術名稱: 軟性OLED封裝技術

技術簡介

整合薄膜封裝與薄型化膠材軟性封裝製程,開發軟性OLED封裝製程,可應用於可摺疊與可捲曲OLED面板技術。

Abstract

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技術規格

1. OLED元件於85°C/85% R.H. 儲存240hrs後,無暗點增加 2. OLED面板經r=15 mm捲曲5,000次後,亮度維持率>95% 3. OLED面板經r=3 mm摺疊100,000次後,亮度維持率>95%

Technical Specification

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技術特色

整合薄膜封裝與薄型化膠材軟性封裝製程,開發軟性OLED封裝製程,可應用於可摺疊與可捲曲OLED面板技術。

應用範圍

軟性環境敏感電子裝置、資訊顯示用可捲曲OLED顯示模組、軟性OLED照明等

接受技術者具備基礎建議(設備)

膠材貼合設備、脫泡設備、PECVD

接受技術者具備基礎建議(專業)

具材料、化工背景

技術分類 顯示中心

聯絡資訊

聯絡人:郝晉明 企劃與研發策略組

電話: 03-5911271 或 Email:erichau@itri.org.tw

客服專線:+886-800-45-8899

傳真:03-58220046

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