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工業技術研究院

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技術名稱: 離型取下製程技術

技術簡介

藉由離型取下應力模擬,開發單載版及雙載板離型取下技術,並建立自動化取下設備,可滿足各式軟性元件的取下製程需求

Abstract

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技術規格

1.自動化設備取下AMOLED面板,亮度維持率≧95%,取下良率80% 2.自動化設備取下觸控薄膜,阻值變化率≦5%,取下良率100%

Technical Specification

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技術特色

藉由離型取下應力模擬,開發單載版及雙載板離型取下技術,並建立自動化取下設備,可滿足各式軟性元件的取下製程需求

應用範圍

穿戴式顯示裝置、 軟性智慧行動裝置、軟性照明

接受技術者具備基礎建議(設備)

切割與取下設備

接受技術者具備基礎建議(專業)

具機械或力學相關專長之人員

技術分類 顯示中心

聯絡資訊

聯絡人:郝晉明 企劃與研發策略組

電話:03-5911271 或 Email:erichau@itri.org.tw

客服專線:+886-800-45-8899

傳真:03-5820046

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