工業技術研究院

技術簡介

本技術之低溫導電膠材料主要成分為銅，銅導電性次於銀，但銅成本低於銀，傳統太陽能用之銀漿需780℃以上的高溫燒結，本技術之低溫導電膠能避免高溫氧化與元件熱損害問題，適用於PERC電池的低溫型匯流電極(busbar)，或異質接面(HJT)等不耐高溫電池結構。

Abstract

Copper is the major component of the low temperature conductive paste in this technique. The conductivity of copper is inferior to that of silver, but the cost of copper is lower than that of silver. The traditional silver pastes of solar cells require to be sintered at high temperature above 780 ° C. The low temperature conductive paste in this technique could avoid oxidation at high temperature and device thermal damage. It could be applied for busbar electrodes of PERC or heterojunction (HJT) structure which exhibits impatience with high temperature.

技術規格

固化溫度230°C，刮刀塗銅膜銅含量為72％，厚度37.5μm，銅膜電阻率5.5×10-5 Ω-cm，室溫的黏度約10800 cps適合網印製程，可依需求調整膠料電性及物性。

Technical Specification

The copper film coated by doctor blade exhibited the copper content of 72％, the thickness of 37.5μm, resistivity of 5.5×10-5 Ω-cm at curing temperature of 230 ° C. The viscosity of the paste is 10800 cps at room temperature and it is suitable for screen printing process. The electricity and physical properties of pastes could be adjusted according to requirements.

技術特色

目前應用於背面鈍化(PERC)太陽電池的匯流排(bus bar)低溫導電銅膠，固化溫度≦230°C，與市售高溫銀膠印製的電池效率相比較，增減介於 -0.3％~0.1％之間。

應用範圍

太陽能導電、RFID、PCB產業等

接受技術者具備基礎建議（設備）

網印機、熱烘烤設備、化學通風排氣設備等

接受技術者具備基礎建議（專業）

化學相關知識技術，實驗室危害防範常識等

聯絡資訊