『您的瀏覽器不支援JavaScript功能,若網頁功能無法正常使用時,請開啟瀏覽器JavaScript狀態』

跳到主要內容區塊

工業技術研究院

:::

技術名稱: 半導體設備通訊訊息交換技術

技術簡介

一種半導體設備通訊標準的訊息交換裝置及其訊息交換方法,訊息交換裝置包括SECS-II訊息通訊部、轉譯部以及資訊儲存裝置存取部,其中還包括用以定義SECS-II訊息之訊息內容與格式的至少一組資料結構檔與一訊息格式檔。轉譯部根據該資料結構檔與訊息格式檔將SECS-II訊息轉譯為各種資訊儲存裝置的資訊儲存格式的資料,以及將資訊儲存裝置的各種資訊儲存格式的資料轉譯為SECS-II訊息,以令機台自動化程式與資訊儲存裝置之間可以透過訊息交換裝置進行訊息交換。應用訊息交換方法於此種訊息交換裝置,不僅可省卻程式開發之成本,同時更具有較高之系統穩定性與產業效益。

Abstract

A SEMI Equipment Communication Standards (SECS) communication device and a method thereof are provided. The SECS communication device includes a SECS-II communicating part, a conversion part and an R/W part. The SECS communication device is further provided with at least one data structural file and one message format file to define the data content and format of a SECS-II message. The conversion part accordingly performs decoding the SECS-II message into an info format applicable to various storage devices and also encoding the info format into the SECS-II message based on the data structural file and the message format file, so as to provide SECS-II/info format conversion between an Equipment Automatic Program (EAP) and a storage device. The SECS communication device and its method thereof are quite advantageous of low production cost, high systematic reliability and industrial benefits even without any extra programming process applied.

技術規格

1. 建立SECS連線 2. 以表格形式設定,無須程式撰寫

Technical Specification

請補充

技術特色

提出一種三維點雲融合二維影像的方法。此三維點雲融合二維影像的方法適用於具有一對稱性的待測工件以進行姿態估測。此方法包括取得對應該待測工件的二維影像與三維點雲。此方法也包括藉由對二維影像進行圖樣特徵分析,取得待測工件的方向性。此方法更包括依照此方向性對該三維點雲進行分割。基此,藉由破壞三維點雲的對稱性,以解決對稱性工件在三維點雲姿態估測的問題。

應用範圍

設備與上層通訊,尤其適用於半導體、PCB、PV、LED等相關設備

接受技術者具備基礎建議(設備)

自動控制

接受技術者具備基礎建議(專業)

自動控制、高階程式設計(如C#、C++、.NET等等)

技術分類 精密機械

聯絡資訊

聯絡人:蔡雅惠 智慧系統工程技術組

電話:+886-3-5916799 或 Email:YaHuiTsai@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5915939

[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]