工業技術研究院

技術簡介

TGV雷射玻璃鑽孔製程是透過雷射改質搭配濕式製程達成高產速鑽孔需求，以雷射中心最新研發之高均質長景深光路模組，可在50 μm至700 μm玻璃厚度下達成高真圓度TGV製程。

Abstract

For high quality and effective communication of wearable device. It is dimension that improves the performance of the integrated chips and power consumption. 3D IC circuit structure (3D IC) is referred to as an appropriate way. According to the demands of 3D ICs, through glass via (TGV) process have more advantage than through silicon via (TSV). In addition, acknowledge for fabricating TGV is indispensable for the needing of transparent substrate based on Micro LED. In high aspect ratio TGV process, glass substrate will be modified by laser irradiation to increase the etching selectivity rate between the irradiated zone and untreated zone.

技術規格

Via diameter 10~80 μm Tape angle ? 85? Roundness ? 92% Glass thickness 50μm~700μm Aspect ratio ? 4

Technical Specification

none

技術特色

為追求更輕薄短小的3C裝置與高頻通訊、4K攝影等高容量訊號傳輸需求，以玻璃作PCB載板與可容納高頻訊號之成孔品質為未來製程需求，本TGV雷射玻璃鑽孔製程是透過雷射改質搭配濕式製程達成高產速鑽孔需求，以雷射中心最新研發之高均質長景深光路模組，可在50 μm至700 μm玻璃厚度下達成高真圓度TGV製程。

應用範圍

Glass interposer 3D-IC package CSP

接受技術者具備基礎建議（設備）

光學、製程、材料、機械、光機電整合

接受技術者具備基礎建議（專業）

微孔光路聚焦技術 雷射景深可調技術 成孔製程技術 雷射觸發控制技術

聯絡資訊