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工業技術研究院

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技術名稱: 超快雷射多層複材切割技術

技術簡介

建立多層透明硬脆材料基板的精密切割系統,整合時脈調整、線型光束及雙焦點透鏡模組,可單道次完成切割及提升切割面的精度。

Abstract

A precision cutting system is developed for multilayer transparent hard and brittle material substrates, integrating temporal pulse modulation, beam filamentation, and bifocal lens modules, to finish the cutting with a single pass and promote cutting surface quality.

技術規格

(a) 時脈調整範圍:0-300 ps (b) 應用材料:多層透明基板 (c) Chipping:< 10 μm

Technical Specification

none

技術特色

.

應用範圍

多層複合基板、鍍膜玻璃基板、硬脆基板

接受技術者具備基礎建議(設備)

none

接受技術者具備基礎建議(專業)

雷射應用

技術分類 精密機械與控制器

聯絡資訊

聯絡人:廖金二 M100

電話:06-6939109 或 Email:artliao@itri.org.tw

客服專線:+886-800-45-8899

傳真:none

[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]