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工業技術研究院

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技術名稱: 雷射倍頻硬脆材料切割技術

技術簡介

整合倍頻與線型光束技術,縮短雷射切割波長,提升材料對雷射的吸收率與切割精度,解決傳統IR雷射無法穿透材料進行加工的問題,可應用於表面有特殊鍍層的硬脆材料基板,如short pass 濾光片等。

Abstract

Develop the laser second harmonic module and the optical layout of laser cutting. Because of shortening the laser wavelength, increase laser absorption of material to get higher material remove rate during the process. Through the optimization of the cutting parameters, develop successfully the cutting for the brittle substrate, e.g., short pass filter, sapphire, glass etc. with the substrate thickness ≦ 2 mm, chipping ≦ 5 μm, roughness ≦ 1 μm Ra.

技術規格

適用波長:500 nm~560 nm 可切割材料厚度 ≦ 2 mm Chipping ≦ 5 μm Roughness ≦ 1 μm Ra

Technical Specification

Wavelength:500 nm~560 nm, Substrate thickness ≦ 2 mm, Chipping ≦ 5 μm, Roughness ≦ 1 μm Ra.

技術特色

得到倍頻波長的長景深切割光路,除提升材料對雷射的吸收率與切割精度,也可應用於基頻光無法吸收的材料進行加工。

應用範圍

半導體、光電、3C產業: 濾光片切割 藍寶石切割 玻璃切割

接受技術者具備基礎建議(設備)

超快雷射源 倍頻光路模組 線型光束模組 PSO同步觸發模組 精密線性平台

接受技術者具備基礎建議(專業)

光學、製程、材料、機械、光機電整合

技術分類 精密機械與控制器

聯絡資訊

聯絡人:廖金二 M100

電話:+886-6-6939109 或 Email:artliao@itri.org.tw

客服專線:+886-800-45-8899

傳真:none

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