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工業技術研究院

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技術名稱: 加成式細微導線製造技術

技術簡介

本技術整合凹版轉印技術及其關鍵組件(塗料、模具等),使可經由印刷、UV活化及金屬化等三道製程直接在基板上印製超細導線,其電性相近於純金屬。

Abstract

This study has developed a manufacture process of printing fine-line pattern, activatiing precursor and metalization to form a circuit with <5um linewidth circuit on a substrate. The conductivity is at the same level with pure copper.

技術規格

轉印幅寬≧500mm、線路線寬≦5μm。

Technical Specification

printint width≧500mm、linewidth≦5μm。

技術特色

整合凹版轉印技術及其關鍵組件(UV固化塗料、轉印模具等),可在基板上直接印製電性相近於純金屬之超細導線。

應用範圍

觸控元件、軟性印刷電路板及光電元件線路等細微線路製作

接受技術者具備基礎建議(設備)

機械、材料、化學基礎知識

接受技術者具備基礎建議(專業)

印刷技術、轉印塗料特性

技術分類 精密機械

聯絡資訊

聯絡人:王裕銘 先進製造技術組(0M000)

電話:03-5912412 或 Email:ymwang@itri.org.tw

客服專線:+886-800-45-8899

傳真:03-5820043

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