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工業技術研究院

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技術名稱: 卷對卷無電鍍設備

技術簡介

開發R2R銅箔基板電鍍設備,藉由蛇腹式之來回移動,大幅縮短電鍍設備之長度

Abstract

Development of R2R electroless copper plating equipment, the equipment can reduce length by the reciprocating snake-like moving.

技術規格

幅寬>500 mm、傳輸速度:0.2M/min-1M/min

Technical Specification

Width> 500 mm 、 transmission speed: 0.2M / min-1M / min

技術特色

開發蛇腹式非接觸R2R化鍍設備開發,能進行雙面化鍍銅沉積,藉由在傳送滾輪上製作噴孔,讓藥液能藉由噴孔噴出,使 PI基材經過滾輪時,能被噴出之藥液撐起而不會與滾輪直接接觸,達到液浮於滾輪的效果而形成非接觸之運動,此方式能避免基材表面圖案刮傷等問題,且能提高化鍍銅之生產速度。

應用範圍

軟性電路板、銅箔基板產業

接受技術者具備基礎建議(設備)

無電鍍設備

接受技術者具備基礎建議(專業)

材料、化學、機械基礎知識

技術分類 精密機械

聯絡資訊

聯絡人:黃萌祺 先進製造技術組(0M000)

電話:+886-3-5915841 或 Email:ach@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5826104

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