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工業技術研究院

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技術名稱: 陶瓷雷射誘發3D金屬線路製作技術

技術簡介

利用表面處理與雷射圖案化技術,可於任何3D/2D陶瓷基材表面形成金屬圖案化結構,無需任何濺鍍或噴塗製程,最小線寬可達15um。且配合開發鍍液分析系統,可控制金屬離子濃度與還原劑濃度

Abstract

The ceramic laser metallization can make 2D/3D metal microstructure by using surface treatment and laser patterning technology without sputtering and induced solution. The line width can be lower than 15μm. In addition, the metal ion concentration and reductant concentration can be monitored by electrochemistry analysis system.

技術規格

(1)最小線寬可達15μm ;(2)可進行多層3D金屬微結構製作;(3)3D對準精度:±20μm

Technical Specification

(1)Minimum line width:15μm ;(2)Multi-layer 3D circuit;(3)Position accuracy:±20μm

技術特色

能於3D陶瓷材料上直接製作3D線路,可應用於高頻元件與陶瓷機殼等

應用範圍

手機天線、半導體、微機電

接受技術者具備基礎建議(設備)

3D雷射、無電鍍設備

接受技術者具備基礎建議(專業)

材料、化學、機械

技術分類 光電與半導體製程設備

聯絡資訊

聯絡人:黃萌祺 先進製造技術組(0M000)

電話:03-5915841 或 Email:ach@itri.org.tw

客服專線:+886-800-45-8899

傳真:03-5826104

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