『您的瀏覽器不支援JavaScript功能,若網頁功能無法正常使用時,請開啟瀏覽器JavaScript狀態』

跳到主要內容區塊

工業技術研究院

:::

技術名稱: 面板級扇出型封裝FOPLP力學模擬技術

技術簡介

面板級扇出型封裝FOPLP之薄膜機械特性量測技術,乃建立 FOPLP取下與結構熱應力模擬技術,以分析FOPLP取下與可靠度測試的失效風險,提高FOPLP良率與性能,降低開發成本。

Abstract

Developing material measurment techiques for FOPLP structure as well as establishing simulation platform to predict the failure issue of FOPLP during de-bonding and RA testing so as to improve the manufacturing yiled of FOPLP.

技術規格

1. FOPLP結構應力模擬。 2. FOPLP機械式取下應力模擬。 3. FOPLP薄膜機械特性量測。

Technical Specification

none

技術特色

面板級扇出型封裝FOPLP之薄膜機械特性量測技術,乃建立 FOPLP取下與結構熱應力模擬技術,以分析FOPLP取下與可靠度測試的失效風險,提高FOPLP良率與性能,降低開發成本。

應用範圍

穿戴式顯示裝置、 智慧行動裝置、IOT裝置、高效能伺服器等之晶片應用

接受技術者具備基礎建議(設備)

面板生產相關設備與應力模擬設備

接受技術者具備基礎建議(專業)

半導體封裝或應力模擬相關背景人才

技術分類 製程

聯絡資訊

聯絡人:李裕正 面板級製程應用技術組

電話:+886-3-5918395 或 Email:YZLee@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820046

[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]